INVITATION

PACK EXPO INTERNATIONAL 2018

Techik Instrument (Shanghai) Co., Ltd yuav tuaj koom PACK EXPO INTERNATIONAL 2018, Kaum Hli 14-17, Chicago, IL USA.

Peb tab tom tos ntsoov rau koj mus ntsib thiab sim lub tshuab ntawm tus kheej.

Koj qhov kev txaus siab yog peb qhov kev txhawj xeeb tshaj plaws.

Techik Pub No.: E-9423

Hnub tim: 14-17 Lub Kaum Hli 2018

MCCORMICK PLACE, CHICAGO, IL USA