ENVITASYON

PACK EXPO INTERNATIONAL 2018

Techik Instrument (Shanghai) Co., Ltd pral ale nan PACK EXPO INTERNATIONAL 2018, oktòb 14-17, Chicago, IL USA.

Nou ap tann vizit ou epi teste machin nan an pèsòn.

Satisfaksyon ou se pi gwo enkyetid nou.

Kabin Techik No.:E-9423

Dat: 14-17 oktòb 2018

MCCORMICK PLACE, CHICAGO, IL USA